Japan, Feb. 6 -- TOYO INK SC HOLDINGS CO LTD,TOHOKU UNIV has got intellectual property rights for 'NOVEL CHALCONE DYE AND COMPOSITION AND METHOD FOR THE PRODUCTION OF THE SAME.' Other related details ... Read More
Japan, Feb. 6 -- UNIV OF TOKYO,FUJITA CORP,CAD CENTER:KK has got intellectual property rights for 'VIDEO DISPLAY DEVICE.' Other related details are as follows: Application Number: JP,2021-196831 Cat... Read More
Japan, Feb. 6 -- KITZ CORP has got intellectual property rights for 'VALVE BODY OF BUTTERFLY VALVE AND BUTTERFLY VALVE.' Other related details are as follows: Application Number: JP,2021-196809 Cate... Read More
Japan, Feb. 6 -- NISSEI ELECTRIC CO LTD has got intellectual property rights for 'OPTICAL FIBER FIXING MEMBER AND OPTICAL CONNECTOR USING THE SAME.' Other related details are as follows: Application ... Read More
Japan, Feb. 6 -- ASAHI KASEI CORP has got intellectual property rights for 'LAMINATED PLATE AND METAL-CLAD LAMINATED PLATE USING THE SAME.' Other related details are as follows: Application Number: J... Read More
Japan, Feb. 6 -- NIPPON PAPER CRECIA CO LTD has got intellectual property rights for 'ABSORBENT ARTICLE.' Other related details are as follows: Application Number: JP,2021-193789 Category (FI): A61F... Read More
Japan, Feb. 6 -- TDK CORP has got intellectual property rights for 'REFLECTIVE BOX AND ANTENNA DEVICE.' Other related details are as follows: Application Number: JP,2021-193482 Category (FI): G01R31... Read More
Japan, Feb. 6 -- SANWA SHUTTER CORP has got intellectual property rights for 'UPWARD MOVEMENT RESTRICTION STRUCTURE OF PANEL BODY.' Other related details are as follows: Application Number: JP,2021-1... Read More
Japan, Feb. 6 -- EBARA CORP has got intellectual property rights for 'POLISHING PAD, SUBSTRATE POLISHING DEVICE, AND MANUFACTURING METHOD OF POLISHING PAD.' Other related details are as follows: Appl... Read More
Japan, Feb. 6 -- NIPPON HOSO KYOKAI has got intellectual property rights for 'OPTICAL DEVICE AND VARIABLE OPTICAL DEVICE.' Other related details are as follows: Application Number: JP,2021-192064 C... Read More